Product type I/O input/output connector
Product specifications USB A/F DIP 90 degree rubber core reverse bending
Generally:
The electroplating specifications are shown in the attached figure below
14.5 * 12.50 * 7.0 in length, width, and height
Board height 7
Underplate residual thickness 0
Pins 4
Window shape N/A
Whether there is flipping or not
Application form: Line to board
Application scope adapter/computer/portable hard drive/TV/car
Minimum packaging quantity 1500pcs
RoHS Yes
Physics:
Materials - Resin High Temperature Thermoplastic
Material - Metal Copper Alloy
Material - Contact area electroplated with gold
Materials - Electroplated Gold in Welding Area
Pin Rows 1
Right angle in direction
PCB positioning pins are
PCB retention force 2DIP
PCB thickness (recommended) 0.80mm
10000 Cycles of lifespan
Packaging form Reel/Ray
Terminal interface type DIP